an organization that conducts research on the industry After TechInsights disassembled the iPhone 15 Pro, they found that the latest ultra-high density D1 (D1b) LPDDR5 16 Gb DRAM chip from Micron was used internally. This was revealed during the process. This is the first time that the industry has ventured into D1.
According to Tech Insights, the technology sector is constantly striving to develop smaller, quicker, and more energy-efficient components. D1 DRAM is widely regarded as the most cutting-edge DRAM process node available anywhere in the world.
After disassembling the iPhone 15 Pro, Tech Insights found the DRAM chip model A3101, which uses Micron’s groundbreaking D1 LPDDR5 16 Gb DRAM chip, code-named Y52P die. This discovery was made after Tech Insights took apart the device.
The unique characteristics of the chip include not only its cutting-edge technology but also its more compact physical dimensions. In addition to this, in comparison to its predecessor, the LPDDR5/5X D1 16 Gb chip, it provides a considerable improvement in density.
Micron does not utilize extreme ultraviolet lithography (EUVL) in the manufacturing process for its D1 DRAM chips.
EUVL is a technology that is utilized in DRAM by competitors such as Samsung and SK Hynix, and it is regarded as a significant driving element in decreasing DRAM processes to sub-15nm levels. IT Home Note: EUVL is a technique that is used in DRAM by competitors such as memory makers Samsung and SK Hynix.
Micron has surpassed everyone’s expectations by successfully developing and manufacturing D1z, D1, and now D1 DRAM chips without making use of the EUVL technology.
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